The vibration load subjected to many products is the combination of several random processes corresponding to different application conditions, such as the various field road load inputs for automotive components. Sometimes the input loads are the combination of random and sinusoidal vibration.
Concurrent vibration and thermal environment is commonly encountered in the service life of electronic equipment, including those used in automotive, avionic, and military products. Though extensive research exists in literature for solder joint failures due to thermal cycling, limited research has been
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