Power semiconductor devices are used in a wide range of applications. In these applications, power semiconductor devices are required to handle large currents and as a result they tend to dissipate large amounts of heat. In addition, the device and their attendant packages must be capable of withstanding power cycling for many years. Traditionally, devices have used high lead die attaches for high electrical and thermal conductivity. Now, with the drive in industry to replace lead-contained solder with lead-free solder alternatives…
Author: Zheng, Yunqi
Source: University of Maryland
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