The drive to increase circuit density with smaller PWB geometries and higher layer counts in multi-layer boards along with the increasing use of electronics in harsh environments for high reliability and safety critical applications (automotive, avionics, medical, military) have made short circuiting of PWBs due to growth of conductive filaments between biased conductors a major concern. In addition, the impending implementation of lead-free soldering processing, which may affect laminate stability and materials choices, can increase the potential for conductive filament formation (CFF) failures. To mitigate these catastrophic failures, it is necessary to understand…
Author: Rogers, Keith Leslie
Source: University of Maryland
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