Conventional plastic encapsulated microcircuits (PEMs) are increasingly being used in harsh environments such as automotive, well-logging, aerospace and military applications. There is a need, therefore, to examine their performance and reliability at high temperatures. A commonly used first level interconnect in PEMs is the gold wirebond aluminum bondpad interface. This interface has been found to have a very limited life at temperatures above 180 °C, due to intermetallic formation and subsequent corrosion…
Author: Chandrasekaran, Arvind
Source: University of Maryland
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