Mechanical Engineering projects, Dissertation topics, Thesis, Mechanical project report ideas, Mechanical engineering project list, Mechanical projects for final year students, Mech engg project topics, Mini projects, Major project mechanical engineering
The popularity of 3D CAD systems is resulting in a large number of CAD models being generated. Availability of these CAD models is opening up new ways in which information can be archived, analyzed, and reused. 3D geometric information is one of
Solder-dipping may be used to replace tin-rich finishes with eutectic tin-lead for tin-whiskering risk mitigation purposes. However, re-finishing also subjects electronic parts to new risks, including damage from the thermal re-finishing profile, finish non-uniformity, incomplete replacement of the pre-existing finish and poor
Power semiconductor devices are used in a wide range of applications. In these applications, power semiconductor devices are required to handle large currents and as a result they tend to dissipate large amounts of heat. In addition, the device and their attendant
Conventional plastic encapsulated microcircuits (PEMs) are increasingly being used in harsh environments such as automotive, well-logging, aerospace and military applications. There is a need, therefore, to examine their performance and reliability at high temperatures. A commonly used first level interconnect in PEMs
This dissertation investigates the durability of solder interconnects of area array packages mounted on Printed Wiring Assemblies (PWAs) subjected to dynamic flexural loads, using a combination of testing, empirical curve fitting and mechanistic modeling. Dynamic 4-point bend tests are conducted on a
In this thesis, dynamics of low immersion milling is explored through analytical and numerical means. Using linear and nonlinear cutting force models, maps are constructed for single degree-of-freedom and two degree-of-freedom systems where the time spent cutting is “small” compared to the
In this dissertation, a framework is developed and demonstrated for the use of a new shape measurement system consisting of fiber Bragg grating (FBG) based strain sensors, a shape determination algorithm based on Frenet frames, and a signal processing algorithm based on
Micromechanical sequential-leaf time delay mechanisms based on SOI/DRIE technology have been designed, fabricated, and characterized. The devices were designed as elements of a larger fuzing system for rifled munitions, in which a passive timing mechanism triggers at a predetermined rotational speed, followed
The effect of process-induced voids on the durability of Sn-Pb and Pb-free solder interconnects in electronic products is not clearly understood and researchers have reported conflicting findings. Studies have shown that depending on the size and location, voids are not always detrimental
Providing a defensible basis for allocating resources for critical infrastructure and key resource protection is an important and challenging problem. Investments can be made in countermeasures that improve the security and hardness of a potential target exposed to a security hazard, deterrence