Convection and Flow Boiling in Microgaps and Porous Foam Coolers
In this project we will discuss about Convection, Flow Boiling, and Porous Foam Coolers. We will also examine an open and foam-filled microgap cooler that offers direct liquid cooling for a simulated electronic/photonic component and eradicates the problematic thermal resistance of the commonly-used thermal interface material (TIM).